Vertical Pin Headers

Features & Benefits
  • Designed for demanding applications with shock, vibration, and elevated temperatures
  • Capillary Action is utilized to improve solder joint strength and pin retention force – 50% higher than J-lead headers
  • High resistance to thermal shock and thermal cycling due to material selection
  • Co-planarity problems eliminated
  • Very forgiving board placement tolerances
  • Minimal real estate required on board
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Information
SKU: H1-X-XXX
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Specification
Finish Specification

Tin Plated

Current Rating

8/Pin

Number of Rows

1

Pins per Row

Dependent on PN

Pin Length (L)

Dependent on PN

Pins

0.025" (0.64mm) Square

Patent

U.S. Patent Nos. 6, 402, 531 B1 and 5, 816, 668

Notes

Zierick recommends .006" (0.15mm) stencil thickness for most applications. For other stencil thicknesses, call Zierick's product development department.

Product specifications listed on the website, catalog, or any documents that may fall under the category of promotional literature are subject to change without notice without creating liability to Zierick Manufacturing Corporation. Please contact us for the most current prints and dimensions.

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