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SMT Headers Use Capillary Action

Components allow broader placement tolerances and "reflow" into position

Zierick Manufacturing Corporation, a leading provider of PCB connectors and assembly equipment, has introduced surface-mountable PCB headers that improve solder joint strength in a wide range of PCB applications through enhanced capillary action of reflowing solder. The capillary action of the solder paste during reflow draws the header down tightly to the PCB, creating a thinner stronger solder-joint. The SMT header design that promotes capillary action also provides a way for solder gases to escape resulting in fewer and smaller voids. The connection formed in this way exhibits 50% higher retention force than that of conventional designs. In addition, the capillary action draws the header into proper position on the solder pad(s) even if the connector has been placed off center. By the same action co-planarity is assured. And finally, the SMT header provides resistance to thermal shock and thermal cycling because the component base is made of the same material as the PCB. This feature contributes to long-term reliability.

Headers are available in a variety of pin lengths and sizes. Unique SMT feeders are available or in development to present these products on a flexible placement system(s) in an automated SMT environment. Samples of headers along with a video disk that shows the capillary action of reflowing solder is available without charge.

To learn more, please use our email form, call us at 800-882-8020 (in New York, 914-666-2911) or write Zierick Manufacturing Corporation, Radio Circle, Mt. Kisco, New York 10549, fax 914-666-0216.
 
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