Features and Benefits |
- Designed for through-board applications where the wires must be connected on the side opposite the other components;
- Reliable in demanding applications with shock, vibration, and elevated temperatures;
- Eliminates the need for hand soldering wires to the board;
- A surface mount version of a proven through-hole version;
- Low profile;
- Terminates a large range of wire gauges;
- IDCs don’t float during reflow;
- Designed for automation using the customer’s existing pick and place equipment and a special feeder, no time consuming hand placement or costly fixturing required, or they can be;
- Automated using standard tape feeders.
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