Parallel Stacking System


	The uniquely shaped Pro-Wave socket fulfills parallel PCB stacking needs in a high-speed matched impedance environment.

Zierick's Pro-Wave interconnection system enables customers to parallel stack several dozen multi-layer circuit boards in a high-speed matched impedance environment, creating a three-dimensional circuit. This solderless interconnection system utilizes pins and internal sockets. The Pro-Wave system allows a staggered row grid density of 0.050" and a minimum PCB-to-PCB interface of 0.062". It accommodates boards with through-holes varying from 0.020" to 0.025" in diameter.

Continuous format Pro-Wave sockets permit placement by automatic equipment in any number of pin counts on both standard and special grid spacings.

Beryllium copper construction with a hard gold finish ensures dependable performance. Pro-Wave's contour allows for multiple contact points even with hole diameter variances up to 0.005.

Beryllium copper construction with a hard gold finish ensures dependable performance. Pro-Wave's contour allows for multiple contact points even with hole diameter variances up to 0.005.

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