| Features and Benefits |
- Designed for demanding applications with shock, vibration, and elevated temperatures
- Capillary Action is utilized to improve solder joint strength and pin retention force - 50% higher than J-lead headers
- High resistance to thermal shock and thermal cycling due to material selection
- Co-planarity problems eliminated
- Very forgiving board placement tolerances
- Minimal real estate required on board
- Zierick’s Horizontal Header is easily customized for a combination of different pin lengths and missing pins for proper mating connector orientation
|
| Loose |
Number of Rows |
Pins per Row |
Pin Length Dimensions |
Number of Missing Pins |
Finish Specification |
Current Rating |
| H1-9-500-T-SP |
1 |
9 |
0.500" (12.70mm) |
2 (#2 and #7) |
Tin Plated |
8/Pin |
| U.S. Patent Nos. 6,402,531 B1 and 5,816,668 |
| Zierick recommends .006" (0.15mm) stencil thickness for most applications. For other stencil thicknesses, call Zierick's product development department. |
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