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Pin Headers |
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The pin is soldered into the
plated through hole at the
same time the header is
soldered to the PC board.
The capillary action provided
by the four cavities (formed
between the pin and plated
through hole) will pull up
the melted solder, resulting
in a stronger solder joint.
The melted solder rises
through the cavities and
forms a ring at the top. The ring indicates that the
reflow process is complete.
The force which pulls the
melted solder into the cavities
will also pull the header board
assembly and the PCB together. |
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Zierick’s unique header assembly features capillary action
to improve solder joint strength. As a result, pin retention
force is 50% higher than that of J-Lead type headers. As
the capillary action draws the solder, it pulls the header
assembly tightly to the PCB. At the same time, co-planarity
problems are eliminated because the force generated by
the capillary action also pulls the header into proper
position over the solder pad – even if the part has been
placed off-center.
A circular solder pad on top of the board and a square
solder pad on the bottom are connected to the conductive
wall of the plated through hole. The size of the hole is
such that it holds the square pin in place, yet leaves four
cavities defined by the flat side of the pin and the curved
wall of the hole. The cavities promote capillary action by
drawing most of the melted solder up through the cavities
where it forms a ring at the top side of the header assembly
board. This solder ring is a visual indication that the
reflow process is perfect and complete.
Further, because the header base is made of the same
material as the PCB, there are no thermally induced stresses
on the solder joint – long term reliability is guaranteed.
In addition, deep score lines run across both sides of the
header base. The assembly is very flexible and can
accommodate board warpage without weakening
connections.
To meet varying application requirements, Zierick headers
are available with pins missing at specified positions or
with pins of different lengths and sizes. Pins are offered in
brass or copper, and optional configurations are available.
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U.S. Patent No. 6,402,531 B1
| Features and Benefits |
- Designed for demanding applications with shock, vibration, and elevated temperatures
- Capillary Action is utilized to improve solder joint strength and pin retention force - 50% higher than J-lead headers
- High resistance to thermal shock and thermal cycling due to material selection
- Co-planarity problems eliminated
- Very forgiving board placement tolerances
- Minimal real estate required on board
- Zierick’s Horizontal Header is easily customized for a combination of different pin lengths and missing pins for proper mating connector orientation
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Surface Mount Connectors
Through Hole Connectors
